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Control of the relief of the substrate SI (001) during thermal annealing in a vacuum chamber |
E. Rodyakina
/
S. Sitnikov
/
D. Rogilo
/
A. Latyshev
|
Pages 407-413 |
Plasma parameters and kinetics of active particles in CF4 (CHF3) + Ar mixtures of variable initial composition |
A. Efremov
/
K.-H. Kwon
/
D. Murin
|
Pages 414-423 |
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Quality control of a multilayer spin-tunnel structure using a combination of analysis methods |
O. Trushin
/
S. Simakin
/
S. Vasiliev
/
E. Smirnov
|
Pages 424-430 |
|
Investigation of fused ohmic contacts to epitaxial layers of gallium arsenide alloyed by tellurium |
A. Nezhentsev
/
V. Egorkin
/
V. Zemlyakov
/
V. Garmash
/
N. Kaluzhny
/
S. Mintairov
|
Pages 431-435 |
Features of the functioning of MEMS with an even number of electrodes |
V. Dragunov
/
D. Osterak
|
Pages 436-450 |
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Modeling the dynamics of the integral dielectric constant of a porous low-k organosilicate film with dry etching of photoresist in O2 plasma |
A. Rezvanov
/
S. Gornev
/
O. Gushin
/
I. Matyushkin
|
Pages 451-459 |
Simulation of effects of single nuclear particles on a STGRS trigger with the separation of transistors into two groups |
V. Stenin
/
Yu. Katunin
|
Pages 460-472 |